Introdutcion:

COS (Chip On Submount) packaging is an efficient and advanced semiconductor laser packaging technology that directly mounts laser chips onto a submount. With advantages such as high efficiency, low thermal resistance, and strong reliability, COS packaging technology has been widely adopted in industrial processing, medical equipment, telecommunications, and other fields.

Advantages:

Low Thermal Resistance

CoS packaging significantly reduces thermal resistance through optimized thermal management design,improvingthe heat dissipation efficiency of laser chips.

Stability

COS packaging delivers outstandingmechanical stability,enabling resistanceto vibration and shock, ensuring reliable operation even in harsh environments.

Power and Wavelength Versatility

COS offers customizable power and wavelength options to meet diverse application requirements.

Specification:

Output Power:  10W~45W

Central Emission Wavelength: 808~1064nm

Spectral Width: 6nm